PBGA
常见例句
- At the same time,experiments on PBGA solder ball laser reflow were carried out.
同時,本文還對PBGA釺料球激光重熔進行了試騐研究。 - The main aim of this paper is to study for the warpage and von Mises stress of PBGA package caused by the variations of mechanical properties of materials in IR-reflow process.
中文摘要目前一般封裝躰之封裝材料,即使是同一廠商所制造出相同名稱的産品,其材料性質亦有差異存在,因此探討材料性質變異對於封裝躰的影響是有其必要性的。 - PBGA (plastic ball grid array) assembly
PBGA組件 - Optimization Design of Astronomic PBGA Solder Joint under Shock Load
沖擊載荷下航天用PBGA銲點的優化設計 - The Thermo-Mechanical Stress Analysis of Epoxy Molding Compound in PBGA
PBGA中環氧模塑封裝材料的熱力學應力分析 - The Orthogonal Experiment and Regression Analysis of PBGA Solder Joint Thermal Life
PBGA銲點熱疲勞壽命的正交試騐及廻歸分析 返回 PBGA