PBGA
基本解释
- 全局灵敏度
英汉例句
- At the same time,experiments on PBGA solder ball laser reflow were carried out.
同时,本文还对PBGA钎料球激光重熔进行了试验研究。 - The main aim of this paper is to study for the warpage and von Mises stress of PBGA package caused by the variations of mechanical properties of materials in IR-reflow process.
中文摘要目前一般封装体之封装材料,即使是同一厂商所制造出相同名称的产品,其材料性质亦有差异存在,因此探讨材料性质变异对于封装体的影响是有其必要性的。 - PBGA (plastic ball grid array) assembly
PBGA组件 - Optimization Design of Astronomic PBGA Solder Joint under Shock Load
冲击载荷下航天用PBGA焊点的优化设计 - The Thermo-Mechanical Stress Analysis of Epoxy Molding Compound in PBGA
PBGA中环氧模塑封装材料的热力学应力分析